Products

H.B. Fuller EA6033 is a fast UV-cure adhesive. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. H.B. Fuller EA6033 has shown excellent adhesion and is flexible. It can be used for BGA reinforcement.

H.B. Fuller 1536 is a gray, flowable, one-component, neutral alkoxy-cure silicone sealant. Low-odor, solvent-free materials cure at room temperature when exposed to moisture in the atmosphere. With fast tacky-free time and meets the UL94-V0 flame rating. Excellent adhesion to glass, ABS, FR4, and PCBs. Superior resistance to thermal cycling, damp heat, and damp freezing Typical applications include electronics encapsulation, connector staking, electronics potting, circuit board encapsulation, electrical component reinforcement, electronic component bonding, and sealing.

Swift®therm 9054 is a hot melt adhesive with a long open time, good spray film, and flexible, moisture- and cold-resistant bondings. It is suitable for bonding various plastic materials to wood as well as textiles, felts, foams, paper, cardboard, and other materials.

H.B. Fuller FH8301 is a single-component, heat-curable epoxy underfill encapsulant designed for flip-chip applications such as system-in-package and modules. It is designed for high adhesion and reliability. FH8301 is formulated to flow consistently without voids on die sizes up to 12 x 12 mm. This material can also improve the reliability of chip scale packages (CSP) and ball grid array (BGA) package assemblies.

H.B. Fuller EA6062 is a fast UV-cure adhesive with a high depth of cure. This product is very soft and flexible and has excellent adhesion and dimensional stability after dispensing. It can be used as a re-enterable form-in-place or cure-in-place gasket material. H.B. Fuller EA6062 has excellent compressibility, elastic recovery, and low compression set.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

Swift®therm 3055 is a hot melt adhesive with good adhesion to filter media, reduced shrinkage, and good flexibility. It has been developed for the manufacture of air filters as a pleat separator. Filter media is a suitable substrate for this product.

H.B. Fuller FH1425 is a two-part epoxy adhesive specifically formulated for encapsulating and protecting electronics in challenging environments. This epoxy system offers flexibility, making it suitable for applications where the electronics require a high level of protection. Its primary use is for the protection of electronics, including electric motors, where a highly flexible epoxy resin system is required.

H.B. Fuller FH3911 A/B is a two-component adhesive and encapsulant widely used in casting applications. It belongs to the urethane chemical family and exhibits a transparent color. This product offers various features and benefits, including biocompatibility, clarity, low outgassing, low viscosity, and optical clarity. It is suitable for multiple application areas, such as potting compounds in electrical and electronics packaging and assembly, as well as printed circuit boards (PCBs).

H.B. Fuller EV Protect 5006 offers battery designers the ability to integrate high-level structural performance characteristics into their battery system, which is ideal for cell to pack applications. This ultra-lightweight material minimizes weight addition to the battery pack and, when exposed to a thermal event, significantly reduces or delays thermal propagation. With a reduced viscosity and improved curing speed, the EV Protect 5006 is especially advantageous for those with unique, complex, or intricate battery design architecture. Works in all types of battery cell form factors (cylindrical, prismatic, or pouch).

H.B. Fuller EA6114 is a high-performance, fluorescence, fast UV/moisture dual-cure adhesive/encapsulant. It is optimized for fast moisture curing, supporting increased manufacturing productivity. This product is suitable for bonding a wide variety of substrates, including glass, many plastics, and most metals. This product has a tack-free surface finish and has shown excellent adhesion and flexibility. It can be moisture-cured in shadowed areas.

Tonsan® SN103W is a highly regarded silicone adhesive that boasts a de-alcohol formulation, a low odor, and excellent non-yellowing properties. Engineered for the specific purpose of sealing and bonding electronic and electrical equipment, it is a perfect fit for electric vehicles.

H.B. Fuller EA6206 is a one-component, ultraviolet light-curable adhesive designed for LCD terminal pin bonding applications. The cured adhesive exhibits high flexibility and toughness, good moisture resistance, and good chemical resistance. The product offers excellent adhesion to glass and is ideal for applications such as flat panel displays (FPD).

H.B. Fuller 7012 is a one-component reactive adhesive with excellent thermal conductivity, specifically designed for bonding battery cells to module bases in electric vehicle applications. It offers a long open time for easy handling while providing immediate fixture strength. This adhesive belongs to the acrylics and acrylates chemical family and is known for its high strength and good thermal conductivity.

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.