Products

Tonsan® 1521 White is a two-component adhesive that can cure quickly at room temperature, providing excellent sealing and bonding. This material is recommended for potting electronic components, particularly junction boxes on PV modules. It has good thermal conductivity and flame retardancy.

Clean Melt® 8429 is a high-performance hot melt adhesive known for its clean running and non-charring properties. It offers exceptional heat stability, allowing it to withstand both low and high temperatures when applied to various substrates. With fast setting capabilities, Clean Melt® 8429 ensures efficient bonding for multiple board types. It exhibits excellent adhesion properties, making it suitable for a broad range of board substrates and PET within the packaging industry. This adhesive is designed to perform reliably across a wide service temperature range, including frozen and hot fill applications. Clean Melt® 8429 is an ideal choice for demanding packaging applications where strong adhesion and temperature resistance are required.

Swift®lock 2020 is designed to set quickly and strengthen within 3-4 minutes. Fully moisture-cured material displays excellent high temperature strength, tested up to 120°C. Rapid shipment of bonded parts is possible as Swift®lock 2020 will not flow or expel at 120°C, preserving bonded geometry at high temperatures even while still uncured.

Swift®tak L52-052 is a water-based bonding solution known for its good heat resistance. It offers the advantage of not requiring a drying step, making the bonding process more efficient. This adhesive is specifically designed for bonding untreated polypropylene (PP) even in wet contact situations. It finds application in press lamination and interiors.