Enhanced TDS
Identification & Functionality
- Chemical Family
- Polymer Name
- Product Type
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Application Area
- Plastics & Elastomers End Uses
- Plastics & Elastomers Processing Methods
- Typical Applications
PHOTOCAP® 6048 is typically used in thin film module constructions to protect the device against moisture ingress.
- Lamination Instructions
- Platen temperature: 140 - 150°C
- Evacuation Time: 180 - 300 seconds
- Cure Time: 300 - 360 seconds
Properties
- Physical Form
- Typical Properties
Value | Units | Test Method / Conditions | |
Tensile Strength | 9.0 | MPa | ASTM D638 |
Ultimate Elongation | 750.0 | % | ASTM D638 |
Adhesion (Glass) | min. 100 | N/cm | HBF |
Moisture Vapor Transmission Rate | max. 7 | g/m²/24 hrs | AFTM F1249 |
Water Absorption | max. 0.1 | wt.% | ASTM D570 |
Optical Transmission | min. 87 | % | ASTM E424 |
UV Cut-off | 360.0 | nm | ASTM E424 |
Shrinkage | max. 5 | % | IEC 62788 |
Volume Resistivity | min. 1 x 10¹⁶ | Ohm cm | ASTM D257 |
Dielectric Strength | min. 30 | KV/mm | ASTM D149 |
Comparative Tracking Index | 600.0 | V | IEC 60112 |
Regulatory & Compliance
- Regulatory Information
PHOTOCAP 6048 is in the process of being UL listed. This product is in category QIHE2 Photovoltaic Polymeric Materials, H.B. Fuller file number E310488.
Safety & Health
- Safety Information
Avoid contact with skin and eyes. Product will irritate eyes if contact occurs. Skin irritation is possible on prolonged or repeated contact.
Packaging & Availability
- Regional Availability
Storage & Handling
- Storage Conditions
Clean and dry conditions below 40°C and 70% RH. For best performance, the product should be stored and used at 65°F – 85°F. Do not freeze.