- Compatible Substrates & Surfaces:Paper, Paperboard
- Features:Multi-Substrate Compatibility, Water Resistant, Fast Setting, Wet Tack, Excellent Substrate Adhesion
FULLABOND WB18 is a versatile adhesive specifically developed for paper converting applications, including board lamination and side seaming of paper. This adhesive exhibits excellent wet tack properties and offers a fast setting speed, ensuring efficient bonding. It provides exceptional adhesion to a wide range of paper substrates and offers good water resistance, contributing to the durability of the final product. FULLABOND WB18 is a reliable choice for achieving strong and secure bonds in paper converting processes, making it suitable for various applications in the industry.