- Chemical Family:Epoxy & Epoxy Derivatives, Epoxides
- Product Type:Reactive Adhesive, Potting Compound, 1K (1 component) Adhesive
- Application Area:Die/Chip Attach, Semiconductor Die Attach, LED Modules
- Features:Good Adhesion
H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.