H.B. Fuller® HL3910EI

Identification

Chemical Family

Polyurethanes (PU)

GBU

EA

RTU Product Type

Hot Melt Adhesive,

Polyurethane (PU) Adhesive

Categories

Technologies → Adhesives & Sealants → Product Families → Bonding & Sealing Chemistry → Thermosetting Adhesives & Sealants

Technologies → Adhesives & Sealants → Product Families → Bonding Technology → Hot Melt Reactive Adhesives

Application Information

Cure Method

Moisture Cure

Applications

Application Area

Woodwork,

Flat Lamination,

Industrial Composites

Compatible Substrates & Surfaces

Textiles,

Wood,

Foam,

Acrylonitrile Butadiene Styrene (ABS),

Polyvinyl Chloride (PVC),

Polyethylene Terephthalate (PET)

Applications & Uses

Cleaning Information

• Clean tools immediately after use.
• Once cured, the material can only be removed mechanically.
• Appropriate cleaners are listed in the product properties table. 
• Cleaner for Uncured Material - PUR-C60, NP2038 L050

Curing Information

• To obtain complete cure, this product should be exposed to temperatures and relative humidity conditions greater than or equal to 25°C and 50% RH.
• For adhesive film thicknesses 0.020 inches or less, cure is typically completed in 7 days under these conditions.
• Complete cure will take longer at lower temperatures and lower RH.
• Cure rates and completeness of cure will vary with adhesive film thickness and substrate’s water permeability. 

Processing Information

• Suitable Substrates - Foam, Various textiles Acrylonitrile butadiene styrene (ABS), Polyvinyl chloride (PVC), Polyethylene terephthalate (PET) and Wood based materials.
• Surface Requirements - Surfaces to be bonded have to be clean, dry and free of grease and oil. Polyolefin materials must be corona-pre-treated or flame-treated. PVC profiles have to be pre-treated with suitable cleaning agents or primers.
• Application instructions - Drum unloader, heating plate, conveyor pump and applicator gun can, as a rule, should be set to different temperatures. Excessive heat may cause decomposition of the adhesive. Depending on the construction of the equipment, a temperature of up to 150°C is sufficient for the heating plate and the conveyor pump. The application equipment may be run at temperatures of up to 130°C. For tank melters only protective gases with < 5ppm humidity should be used. Positive results have been achieved with nitrogen.
• Lower temperatures than recommended can cause higher viscosity which result in reduced bond strength and reduced wetting. Depending on the construction of the equipment, a continuous heating above processing temperature can cause decomposition of the adhesive. Tank melters should use protective gases with < 5 ppm humidity, only

Features

Ready-to-Use Product Features

Good Adhesion,

Heat Resistance,

High Initial Bonding Strength

Features & Benefits

Product Benefits

• High initial bonding strength
• High heat resistance
• Good adhesion to a variety of substrates
• One-component processing
   

Packaging & Availability

Regional Availability

• Global

Physical Properties

Physical Form

Solid

Storage & Handling

Storage Information

• Store in the original unopened packaging in a cool, dry place.
• Shelf life: 9 months from date of manufacture (see details onlabel).