Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Applications
- Application Area
- Compatible Substrates & Surfaces
- Cure Method
- Curing Conditions
Cure speed will vary with temperature, relative humidity, depth of material and presence of moisture. Some applications may require special surface preparation. At 21 - 25°C, 45 - 55% relative humidity, typical cure depth is 2mm in 24 hours. Requires more time to cure in colder or lower humidity conditions.
- General Instructions
- For best performance bond surfaces should be clean, dry and free of any contaminants and oils.
- Apply a continuous and even bead of silicone to one surface.
- Assemble parts immediately. Remove excess material at once.
Properties
- Color
- Physical Form
- Appearance
- Translucent
- Electrical Properties
Value Units Test Method / Conditions Volume Resistivity 5.0 x 10¹⁴ Ω.cm IEC60093, GB/T1692 Breakdown Voltage 18.0 kV/mm IEC 60243-1, GB/T1695 - Cured Properties
Value Units Test Method / Conditions Hardness 30.0 - ISO7619, GB/T 531, Shore A Tensile Strength (50% RH) 1.3 MPa ISO37, GB/528 Thermal Service Range - 54 - 210 °C - Elongation at Break (50% RH) 350.0 % ISO37, GB/528 - Damp Heat Aging Test Properties
Value Units Test Method / Conditions Elongation at Break (at 175ºC, for 168 hr, 50% RH) 320.0 % ISO37, GB/528 Tensile Strength (at 175ºC, 168h, 50% RH) 1.4 MPa ISO37, GB/528 - Uncured Properties
Value Units Test Method / Conditions Tack Free Time 3 - 15 min - Full Cure Time (21 - 25°C, 45 - 55% RH, min. 2mm) 24.0 h - - Rheological Properties
Value Units Test Method / Conditions Viscosity Thixotropic paste - -
Packaging & Availability
- Regional Availability
- Packaging Information
- 85ml
- 310ml
Storage & Handling
- Storage Condition
Product shall be ideally store in a cool, dry area in unopened containers. Material should be stored at a temperature of 5 - 25°C. Do not return unused material back into the container.