Clean Melt® PHC 7688

1 of 10 products in this brand

Clean Melt® PHC 7688 is a hot melt adhesive with multiple benefits, including suitability for use with fast machines, good adhesion on standard packaging, a wide service temperature range, economical use, very good heat stability, and low odor. This product is typically used for bonding paper, cartons, and corrugated boards with conventional surfaces.

Product TypeHot Melt Adhesive

Application AreaCartons, Cases, Ream Wrapping, Straw Attachment

Compatible Substrates & SurfacesPaper

FeaturesCost Effective, Good Adhesion, Heat Resistance, Long Shelf Life, Low Odor, Wide Temperature Operating Range

Technical Data Sheet

Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Product Benefits
  • Multipurpose product for fast machines
  • Good adhesion on standard packaging
  • Wide service temperature range
  • Economically to use
  • Very good heat stability

Applications & Uses

Compatible Substrates & Surfaces
Typical Applications
  • Clean Melt® PHC 7688 is used for paper, carton and corrugated boards with conventional surfaces.
  • Other options are ream wrapping, straw attachment on beverage containers as well as manufacture of paper bags & sacks (closure, longitudinal pasting, and bottom flap fixing and handles attachment).
Application Instructions
  • Apply by nozzle: Wheel or disc system
  • This product is used in the packaging Industry on all known tray erectors and case & carton sealing equipment.
  • Application Temperature: 150°C - 180°C
  • Open time: Very short
  • Setting: Very fast


Typical Properties
ValueUnitsTest Method / Conditions
Filmhard, elastic, dry
Softening Point (R&B)approx. 114°CASTM E 28-99
Density (at 23°C)approx. 0.99g/cm³
Viscosity (Brookfield, Sp27, at 175°C)approx. 900mPa.sASTM D 3236-88

Packaging & Availability

Country Availability
Regional Availability
  • China
  • Europe (Excluding Russia)

Storage & Handling

Shelf Life
24 Months
Storage Conditions
  • In original sealed packaging protected from sun, dust, moisture and high temperatures.
  • When exposed above +30°C the product can agglomerate and has to be loosen-up before usage.