Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Application Area
- Application Method
- Compatible Substrates & Surfaces
- Typical Applications
Developed for case and carton sealing applications where high heat resistance is required.
- Suitable Substrates
Cardboard
- Application Instructions
- Apply by nozzle.
- Proposed application temperature: 160°C - 190°C
- This hot melt adhesive, with innovative raw material base, has stronger adhesion and a lower density than conventional hot melts based on EVA, which means an excellent bonding is reached at once with high mileage and efficiency.
- Due to this composition and the lower density the adhesive is not mixable with conventional hot melts. If other adhesives have been used before, the adhesive equipment has to be thoroughly cleaned.
Properties
- Color (Properties)
- Typical Properties
Value Units Test Method / Conditions Film Hard, elastic, dry - - Viscosity (Sp27, at 175°C) approx. 1250 mPa.s ASTM D 3236-88, Brookfield Softening Point (Ring and Ball) approx. 115 °C ASTM E28-99 Viscosity (Sp27, at 150°C) approx. 2500 mPa.s ASTM D 3236-88, Brookfield Density (at 23°C) approx. 0.97 g/cm³ -
Packaging & Availability
- Regional Availability
Storage & Handling
- Shelf Life
- 24 Months
- Storage Conditions
- In original sealed packaging protected from sun, dust, moisture and elevated temperatures.
- Do not store above +35°C to received free-flowing advantage or loosen up in case of any agglomeration caused by differing transport conditions.