Potting Compounds

H.B. Fuller MP54750 is a low-viscosity polyamine epoxy designed for bonding metals and plastics. It is also ideal for highway and bridge deck repairs, potting, casting, encapsulation, synthetic flooring systems, maintenance coatings, and tank and pipe linings. This product provides good chemical, corrosion, and water resistance.

H.B. Fuller U3356 is a high-viscosity, UV-curable adhesive with a tack-free surface finish. Its excellent bonding properties make it suitable for a wide range of materials, including plastics, glass, and metals. Additionally, it is well-suited for potting and encapsulation applications, providing protection and reliability. U3356 is a UV and light-cure adhesives and finds application in industries where rapid and strong bonding is required.

H.B. Fuller 1536 is a gray, flowable, one-component, neutral alkoxy-cure silicone sealant. Low-odor, solvent-free materials cure at room temperature when exposed to moisture in the atmosphere. With fast tacky-free time and meets the UL94-V0 flame rating. Excellent adhesion to glass, ABS, FR4, and PCBs. Superior resistance to thermal cycling, damp heat, and damp freezing Typical applications include electronics encapsulation, connector staking, electronics potting, circuit board encapsulation, electrical component reinforcement, electronic component bonding, and sealing.

H.B. Fuller FH1425 is a two-part epoxy adhesive specifically formulated for encapsulating and protecting electronics in challenging environments. This epoxy system offers flexibility, making it suitable for applications where the electronics require a high level of protection. Its primary use is for the protection of electronics, including electric motors, where a highly flexible epoxy resin system is required.

H.B. Fuller FH8731 is a one-part epoxy potting material designed for the encapsulation of electronic parts. It features easy handling due to its one-part formulation, good stability, and fast curing at medium temperature. It is typically used for the encapsulation and protection of electronic parts.

H.B. Fuller FH4008AB is a two-component epoxy adhesive formulated for potting applications, particularly for circuit board protection. One of the key advantages of the H.B. Fuller FH4008AB is its excellent isolation resistance. This means that it provides effective electrical insulation, preventing the flow of current between components and ensuring proper circuit functionality. Another notable feature of H.B. Fuller FH4008AB is its resistance to aging hardening. This means that the adhesive maintains its performance and properties over time, even under prolonged exposure to various environmental conditions. Furthermore, H.B. Fuller FH4008AB offers a high service temperature, indicating its ability to withstand elevated temperatures without significant degradation.

Tonsan® EP832 is an epoxy adhesive known for its high strength, good toughness, and heat resistance up to 150°C in the long term and 180°C in the short term. With its low viscosity, it is suitable for potting bonding and exhibits excellent bonding performance to metal, stone, wood, ceramic, and most plastics. This adhesive is commonly used in the electric vehicle industry.

H.B. Fuller FH8732B is a one-part epoxy adhesive that serves as a heat curable potting material. It offers good flow and is effective at filling gaps at room temperature. This epoxy is primarily used as an excellent heat cure encapsulant with low coefficient of thermal expansion (CTA) in electronics applications, specifically for electric motors.

H.B. Fuller FH3911 A/B is a two-component adhesive and encapsulant widely used in casting applications. It belongs to the urethane chemical family and exhibits a transparent color. This product offers various features and benefits, including biocompatibility, clarity, low outgassing, low viscosity, and optical clarity. It is suitable for multiple application areas, such as potting compounds in electrical and electronics packaging and assembly, as well as printed circuit boards (PCBs).

H.B. Fuller FH8800 is a fast-curing, single-component epoxy adhesive that exhibits excellent adhesion to various materials. It is designed for optically clear bonding or LED die attachment and serves as a potting material. The adhesive can be cured rapidly at 100˚C.

H.B. Fuller EV Protect 4006 is a liquid-applied, two-component, flame-retardant, low-density polyurethane foam material designed for the potting and encapsulation of battery cells in EV battery modules. EV Protect 4006 SFR offers battery design engineers the ability to increase the power density of their modules while enhancing safety and protection from thermal propagation. The ultra lightweight nature of the EV Protect 4006 SFR minimizes the weight impact to the battery modules. The semi-structural properties of the material also provide noise, vibration, and harshness benefits to the battery system by unitizing the battery module and absorbing external environmental impacts.

H.B. Fuller 1527L is a low viscosity, one-component, neutral cure silicone adhesive and sealant. It is a UL94 certified flame retardant material with excellent adhesion to a wide range of substrates. This adhesive offers low/no odor and high heat resistance, as well as superior UV resistance and weather resistance.

H.B. Fuller UR 3543 A-E + UR 3543 BTF-E is a two-component polyurethane adhesive with excellent adhesion to wet and dry reverse osmosis membranes, as well as excellent resistance to acidic and basic solutions. It is typically used as an adhesive for osmosis filter bonding and potting applications.

H.B. Fuller EY1514AB is a 2K thermally conductive epoxy adhesive suitable for general potting/encapsulation and electric vehicles. It belongs to the epoxy and epoxy derivatives chemical family and is a conductive and reactive encapsulant. It is categorized under 2K liquid reactive adhesives and functional adhesives within adhesives and sealants technologies and is used in potting compounds for electrical and electronics applications.

H.B. Fuller 1535 is a one-component, silicone adhesive sealant that cures on exposure to atmospheric moisture to form a silicone elastomer. This material is known for its excellent electrical properties, weather stability, chemical resistance, flame retardancy, and thermal conductivity. It exhibits good adhesion to most common building substrates, such as glass, metal, plastic, FR4, and lead frames.