- Product Type:1K (1 component) Adhesive, Reactive Adhesive
- Application Area:Die/Chip Attach, Microelectromechanical Systems (MEMS) Applications, Optoelectronics Devices
- Application Method:Injection
- Chemical Family:Acrylics & Acrylates
- Features:High Consistency, Fast Curing, Low Outgassing, Good Bonding Strength, Low Stress, Good Thermal Stability, Thixotropic, Low Temperature Curing
H.B. Fuller FH8805 is a single-component adhesive that cures by heat. It has fast curing at low temperatures and outstanding bond strength. This material is recommended for use with chip bonding in microelectronic, MEMS, and opto-electronic applications. This material is able to snap-cure during in-line production.