H.B. Fuller FH8708T

Identification

Chemical Family

Epoxy & Epoxy Derivatives,

Epoxides

GBU

EA

RTU Product Type

1K (1 component) Adhesive,

Reactive Adhesive,

Edge Bond Material

Categories

Markets → Consumer Goods → Applications → Appliances & Electronics

Markets → Electrical & Electronics → Applications → Packaging & Assembly → Adhesives & Sealants

Markets → Electrical & Electronics → Applications → Parts & Components → Printed Circuit Boards (PCBs)

Technologies → Adhesives & Sealants → Product Families → Bonding Technology → 1K Liquid Reactive Adhesives

Application Information

Cure Method

Heat Cure

Applications

Application Area

Electronic Components,

Printed Circuit Boards

Applications & Uses

Clean-Up

Equipment, brushes, and spillage can be cleaned promptly after use with a mixture of anhydrous isopropyl alcohol and acetone that should be discarded after each use.

Preparation for Material Usage

1. Do not open the package before complete the thawing.
2. Thawing to room temperature (25°C) before using.
3. Could be repairable at 240 °C
4. Seal any remaining material and store immediately at 2-8°C, we do not recommend thawing material more than three times.

Features

Ready-to-Use Product Features

High Glass Transition Temperature,

Low Thermal Expansion,

Fast Cure,

High Reliability

Features & Benefits

Features and Benefits

• Low CTE
• High Tg.
• Fast cure at moderate temperature minimizing stress on components.
• Repairable without damage to the attach pad

Packaging & Availability

Regional Availability

• Asia Pacific
• Europe
• North America
• Latin America
• India/MiddleEast/Africa (IMEA)

Physical Properties

Color (Properties)

Black

Properties

Density:

1580 kg/m³

Dielectric Strength:

16.3 kV/mm

Specific Gravity:

1.58

Physical Properties of Cured Material

	Value	Units	Test Method / Conditions
Elongation at Break (at 100°C cured, 30min)	3.1	%	ASTM D-0412
Hardness (at 100°C cured, 30min)	80	Shore D	ASTM D2240
Transition Temperature (at 100°C cured, 30min)	163	°C	-
Water Absorption (at 24h at 100°C, 30min)	0.21	%	-

Uncured Properties

	Value	Units	Test Method / Conditions
Specific Gravity	1.58	-	-
Thixotropic Index	4.22	-	-
Viscosity (at 25°C, 100 rpm)	41280	cPs	-
Working Pot Life	3	days	-

Cured Properties

	Value	Units	Test Method / Conditions
Coefficient of Thermal Expansion (cured at 100°C, 30 min, alpha 1)	24	m/m.°C	ASTM E-831
Coefficient of Thermal Expansion (cured at 100°C, 30 min, alpha 2)	117	m/m.°C	ASTM E-831

Electrical Properties

	Value	Units	Test Method / Conditions
Dielectric Strength	16.3	kV/mm	ASTM D-149
Surface Resistivity	12000000000000000	ohm	ASTM D-257
Volume Resistivity	41000000000000000	Ω-cm	ASTM D-257

Typical Properties

	Value	Units	Test Method / Conditions
Storage Temperature	2 - 8	°C	-

Storage & Handling

Storage Conditions

FH8708T is supplied in 30ml/syringes
It should be stored in a 2-8°C refrigerator.
Shelf life is 6 months from date of manufacture.

Shelf Life

6 months

Technical Details & Test Data

Curing Profile

• Recommended cure conditions:
  • 5 minutes @ 150℃
  • 10 minutes @ 130℃
  • 30 minutes @ 100℃